Visual Inspection

• Description: Visual inspection is performed to check for obvious defects or damages in the incoming materials before proceeding to more complex testing. It ensures that materials are free from physical defects such as cracks, discoloration, or misprints, which could lead to failure in the assembly process.

• Process Detail:

  • Physical Condition Check: Inspect the external condition of each part to ensure it has not been physically damaged during transit. Look for signs of damage such as bent leads, cracks in semiconductors, damaged or missing labels, or corrosion on the connectors.

  • Component Appearance: Verify that components have the correct markings (e.g., part numbers, manufacturers’ marks) and that they are legible. Incorrect or missing markings could suggest counterfeiting or damage during manufacturing, which could affect the component’s functionality.

  • Packaging Inspection: Check the packaging to confirm that the materials are correctly stored to prevent contamination or damage. For example, components sensitive to moisture (like ICs) should be sealed in moisture-proof bags, and static-sensitive components should be in anti-static packaging.

  • Color and Surface Condition: Inspect for any signs of discoloration or damage on the surface, especially for items like resistors, capacitors, or ICs, which could indicate problems such as overheating, poor manufacturing, or aging.