✅ Manual Soldering Process Using Soldering Station – Step-by-Step

1. Soldering Station Setup

Purpose:
Prepare the soldering equipment and workstation before starting manual soldering.

Key Actions:

• Switch on the soldering station and set the temperature (typically 300°C–350°C depending on solder alloy).

• Ensure the tip is clean and tinned.

• Check availability of consumables: solder wire, flux, tip cleaner (sponge or brass wool).

• Follow ESD safety procedures (wear wrist strap, use anti-static mats).

2. Tip Cleaning and Tinning

Purpose:
Ensure the soldering iron tip is clean and conductive for effective heat transfer.

Key Actions:

• Clean the tip using a damp sponge or brass wire before soldering.

• Apply a small amount of solder (tinning) to the tip to prevent oxidation.

• Repeat cleaning/tinning regularly during use.

3. Component Insertion (If Not Done Already)

Purpose:
Manually place the component into the designated hole of the PCB.

Key Actions:

• Confirm component orientation (especially for diodes, electrolytic capacitors, ICs).

• Insert the component leads into the PCB holes.

• Slightly bend or clip the leads on the solder side to secure the component.

4. Applying Heat and Solder

Purpose:
Form a proper solder joint between the component lead and the PCB pad.

Key Actions:

• Touch the soldering tip to the junction of the lead and pad for ~1–2 seconds.

• Feed solder wire to the joint (not the tip directly) until it flows smoothly.

• Remove solder wire first, then the soldering tip.

Result:
A clean, shiny, concave solder joint that covers the pad and secures the lead.

5. Joint Inspection and Cleaning

Purpose:
Verify the solder joint quality and clean up if needed.

Key Actions:

• Visually inspect for:

  • Proper wetting

  • No cold joints, voids, or bridges

  • Sufficient solder coverage

• Remove excess flux residue with isopropyl alcohol (if using flux that requires cleaning).

6. Rework (If Required)

Purpose:
Correct soldering defects or reposition components.

Key Actions:

• Use solder wick or a desoldering pump to remove excess solder.

• Reapply solder as needed.

• Replace components if damaged or improperly oriented.

7. Final Quality Check

Purpose:
Confirm the overall quality of the manually soldered assembly.

Key Actions:

• Check for:

  • All joints properly soldered

  • No shorts or open connections

  • Clean and safe PCB surface

• Label or document the board as complete and move it to the next station.

✅ Typical Soldering Station Parameters