Course Content
🏭 Electronics Manufacturing Industry Overview
🏭 Electronics Manufacturing Industry Overview
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Electronics Manufacturing Industry Overview
05:29
📈 Market Growth of Electronics Manufacturing
🧩 Industries That Use SMT Technology
👨‍💼 EMS Careers and Opportunities
Electronics Components Introduction
Detail study about Electronics Component Required for Electronics Product Manuafcturing
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🧩 Electronics Components Overview
04:15
🧩 Electronic Components Packages and Mounting Types for PCB Assembly
Bare PCB introduction (Non Populated)
🏭 Electronics Manufacturing Process – Step-by-Step Overview
🏭 Electronics Manufacturing Process – Step-by-Step Overview
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🏭 Electronics Manufacturing Process – Step-by-Step Overview
00:00
1. 🛒 Component Sourcing and Procurement
Electronics Components Sourcing and Procurement
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1.1 Identify Required Components
1.2 Component Selection
1.3. Supplier Selection
1.4. Purchasing the Components
1.5. Logistics and Shipping
1.6.Sourcing for Obsolete or Hard-to-Find Components
1.7. Supplier Relationship Management
1.8. Global Electronics Components Supplier
1.9. Material Receipt ERP Entry
2. 🧾 Incoming Material Inspection (IQC)
2. 🧾 Incoming Material Inspection (IQC)
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2.1. Material Receipt
2.2. Document Verification
2.3. Visual Inspection
2.4. Quantitative Check
2.5. Functional Testing (if applicable)
2.6. Sampling and Lot Testing
2.7. Compliance Verification
2.8. Incoming Inspection ERP Entry
3. 🏬 Warehouse and Storage Management
3. 🏬 Warehouse and Storage Management
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3.1.  Categorization of Components
3.2.  Environmental Control
3.3.  ESD Protection and Safe Storage Practices
3.4.  Moisture-Sensitive Device (MSD) Handling
3.5. Inventory Organization and Bin Management
3.6. FIFO / FEFO Implementation
3.7.  Traceability and Labeling
3.8.  Regular Monitoring and Stock Rotation
3.9. Safety and Compliance
3.9A.  Storage Area Layout and Zoning
4. 📊 Production Planning and Scheduling
4. 📊 Production Planning and Scheduling
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✅ 4.1. Demand Analysis and Forecasting
4.2. ✅  Bill of Materials (BOM) Review and Finalization
✅ 4.3. Material Requirement Planning (MRP)
✅ 4.4.Capacity Planning
✅ 4.5. Production Scheduling
✅ 4.6. Work Order Generation and Release
✅4.7. Shop Floor Execution and Monitoring
✅ 4.8. WIP (Work in Progress) Management
✅ 4.9. Production Reporting and Performance Review
✅ 4.9A. Continuous Improvement and Feedback 
5. 🤖 SMT (Surface Mount Technology) Assembly Process
5. 🤖 SMT (Surface Mount Technology) Assembly
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5.1. Solder Paste Printing Process
5.2. Solder Paste Inspection (SPI)
00:00
5.3. Pick and Place -Component Mounting
5.4. Pre Reflow -AOI Inspection
5.5. SMT Reflow Soldering
5.6. Post Reflow AOI Inspection
00:00
5.7. SMT PCB Xray Inspection
5.8. SMT PCB Assembly Rework
5.9. SMT PCB Cleaning Process
6.THT (Through-Hole Technology) Assembly Process
THT (Through-Hole Technology) Assembly
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6.1. THT Assembly Process
6.2. Manual Soldering Process
7. 🔍 In-Process Quality Control (IPQC)
7. 🔍 In-Process Quality Control (IPQC)
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7.1. Inprocess Quality Control
7.2. Inprocess Inspection Checkpoints
7.3. Inprocess Quality Control -Non Conformance management
7.4. Soldering Defects According to IPC-A-610
8.Assembly Standards Requirements for PCB Assembly
Assembly Standards for PCB Assembly
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8.1 .✅ Component Placement Standards
✅ 8.2. Soldering Standards
✅ 8.3. PCB Surface and Component Cleaning
✅8.4. Inspection and Testing Standards
✅ 8.5. Packaging and Labeling Standards
✅8.6. Compliance with Industry Regulations
✅ 8.7. Documentation and Reporting Standards
9. Functional Testing (FCT)
Functional Testing (FCT)
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9.1. Functional Testing (FCT)
10.Repair and Rework Process
Repair and Rework Process
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10.1. SMT PCBA Repair & Rework Process
11. 🌡️ Environmental and Reliability Testing (if applicable)
🌡️ Environmental and Reliability Testing (if applicable)
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11.1. Confirmal Coating Process for PCBA
11.2. Environmental and Reliability Testing
12. 📦 Box Build / System Integration
📦 Box Build / System Integration
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12.1. Box Build / System Integration Process
13.🔗 Traceability in Electronics Manufacturing
🔗 Traceability in Electronics Manufacturing
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13.1. Traceability in Electronics Manufacturing Process
14.Industry 4.0 in Electronics manufacturing
Industry 4.0 in Electronics manufacturing
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14.1. Industry 4.0 in Electronics Manufacturing
15. 🏷️ Packaging and Labeling
🏷️ Packaging and Labeling
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15.1 🏷️ Packaging and Labeling
16.✅ Key Principles of ESD Compliance
✅ Key Principles of ESD Compliance
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16.1. ESD Compliance in Electronics Manufacturing
17. 📦 Finished Goods (FG) Handling and Delivery
📦 Finished Goods (FG) Handling and Delivery
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17.1 .FG handling and Delivery
Professional in Electronics Manufacturing -SMT Process
About Lesson

✅ 8.1. Component Placement Standards

Objective:
Ensure that components are correctly placed on the PCB for optimal performance and functionality.

Key Requirements:

  • Component Positioning: Components should be placed within the specified tolerances (often ±0.1mm or better) to prevent issues during soldering or mechanical interference.

  • Orientation: Polarity-sensitive components (e.g., diodes, capacitors, and ICs) must be placed in the correct orientation as indicated by the design.

  • Clearance: Sufficient clearance between components to allow for proper heat dissipation, avoid electrical shorts, and ensure there is no mechanical interference.

  • Placement Accuracy: Fine-pitch components (e.g., BGAs) require precise placement and should be aligned to within the tolerances specified by the manufacturer.

  • Component Type Compliance: Ensure that only authorized components, as specified in the design (BOM), are used for assembly.

Standards:

  • IPC-2221: Generic requirements for designing printed boards and other forms of component mounting or interconnecting structures.

  • IPC-2581: A standard for the design and manufacturing of printed circuit boards.

  • J-STD-001: Requirements for soldered electrical and electronic assemblies, including component placement.

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