✅ 8.3. PCB Surface and Component Cleaning
Objective:
Ensure that PCBs and components are free from contaminants, ensuring reliable solder joints and preventing corrosion.
Key Requirements:
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Cleaning After Soldering: PCBs must be thoroughly cleaned after soldering to remove flux residues, which could cause electrical shorts or corrosion over time.
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Cleaning Agents: Use cleaning agents that are compatible with PCB materials and the soldering process.
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Cleaning Methods: Use ultrasonic cleaning, manual scrubbing, or air knives to remove flux residues or other contaminants from the surface.
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Component Cleaning: Ensure that components are free of any residues before placement on the PCB.
Standards:
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IPC-610: Guidelines for acceptable levels of cleaning based on the class of the product.
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IPC-CH-65: Cleaning standard for assembly processes in electronics manufacturing.