✅8.4. Inspection and Testing Standards

Objective:
Ensure the PCB assembly meets electrical, mechanical, and thermal requirements through rigorous testing and inspection.

Key Requirements:

• Visual Inspection: Ensure that components are properly placed, oriented, and soldered. Check for solder bridges, cold joints, misalignments, and component damage.

• Automated Optical Inspection (AOI): Use AOI to detect defects in component placement, soldering, and any missing components.

• X-ray Inspection: For complex components like BGAs (Ball Grid Arrays), use X-ray inspection to confirm proper solder joints that are not visible to the naked eye.

• Electrical Testing: Perform In-Circuit Testing (ICT) to check for electrical continuity and functionality, ensuring there are no open circuits or shorts.

• Functional Testing: Conduct tests to verify that the PCB functions as intended in its operational environment.

• Thermal Testing: Subject the PCB to thermal cycling or heat exposure to simulate real-world operating conditions and check for thermal performance and stability.

Standards:

• IPC-2221: Generic requirements for designing printed boards and mounting or interconnecting structures.

• IPC-6012: Qualification and performance of printed boards.

• IPC-A-610: Acceptability of electronic assemblies (also applicable for inspection).