Course Content
Electronics Components Introduction
Detail study about Electronics Component Required for Electronics Product Manuafcturing
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🏭 Electronics Manufacturing Process – Step-by-Step Overview
🏭 Electronics Manufacturing Process – Step-by-Step Overview
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6.THT (Through-Hole Technology) Assembly Process
THT (Through-Hole Technology) Assembly
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9. Functional Testing (FCT)
Functional Testing (FCT)
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10.Repair and Rework Process
Repair and Rework Process
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11. 🌡️ Environmental and Reliability Testing (if applicable)
🌡️ Environmental and Reliability Testing (if applicable)
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12. 📦 Box Build / System Integration
📦 Box Build / System Integration
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13.🔗 Traceability in Electronics Manufacturing
🔗 Traceability in Electronics Manufacturing
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14.Industry 4.0 in Electronics manufacturing
Industry 4.0 in Electronics manufacturing
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15. 🏷️ Packaging and Labeling
🏷️ Packaging and Labeling
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16.✅ Key Principles of ESD Compliance
✅ Key Principles of ESD Compliance
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17. 📦 Finished Goods (FG) Handling and Delivery
📦 Finished Goods (FG) Handling and Delivery
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Professional in Electronics Manufacturing -SMT Process
About Lesson

✅ 8.3. PCB Surface and Component Cleaning

Objective:
Ensure that PCBs and components are free from contaminants, ensuring reliable solder joints and preventing corrosion.

Key Requirements:

  • Cleaning After Soldering: PCBs must be thoroughly cleaned after soldering to remove flux residues, which could cause electrical shorts or corrosion over time.

  • Cleaning Agents: Use cleaning agents that are compatible with PCB materials and the soldering process.

  • Cleaning Methods: Use ultrasonic cleaning, manual scrubbing, or air knives to remove flux residues or other contaminants from the surface.

  • Component Cleaning: Ensure that components are free of any residues before placement on the PCB.

Standards:

  • IPC-610: Guidelines for acceptable levels of cleaning based on the class of the product.

  • IPC-CH-65: Cleaning standard for assembly processes in electronics manufacturing.


 

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