1. 🛒 Component Sourcing and Procurement

• Objective: Secure electronic components and raw materials needed for product assembly.

• Activities:

  • Identify Bill of Materials (BOM) from product design.

  • Select approved vendors or distributors (e.g., Digi-Key, Mouser, Avnet).

  • Request quotations, compare lead times and prices.

  • Verify authenticity and compliance (RoHS, REACH).

  • Issue purchase orders (POs) and track deliveries.

• Tools Used: ERP systems, supplier portals.

2. 🧾 Incoming Material Inspection (IQC)

• Objective: Ensure components and materials meet quality standards before use.

• Activities:

  • Visual inspection for damage, corrosion, packaging issues.

  • Verification of part numbers and specifications.

  • Electrical testing (where applicable).

  • Moisture sensitivity level (MSL) check for ICs.

  • Document inspection results and approve/reject batches.

• Standards: IPC-A-610, JEDEC standards.

3. 🏬 Warehouse and Storage Management

• Objective: Store components under optimal conditions to prevent damage or degradation.

• Activities:

  • Allocate components to designated bins/shelves.

  • Use FIFO or FEFO inventory logic.

  • Maintain ESD (Electrostatic Discharge) safe zones.

  • Store MSL-sensitive devices in dry cabinets or vacuum-sealed packs.

• Tools: Barcode scanners, warehouse management systems (WMS).

4. 📊 Production Planning and Scheduling

• Objective: Align material availability, manpower, and machine capacity with production goals.

• Activities:

  • Generate production orders based on customer demand or forecast.

  • Plan SMT line setup, THT line scheduling, test station availability.

  • Allocate resources and manpower.

  • Communicate plans to relevant departments.

• Tools: ERP, MES (Manufacturing Execution Systems).

5. 🤖 SMT (Surface Mount Technology) Assembly

• Objective: Automatically place and solder surface-mount components on the PCB.

• Process Steps:

  1. Solder Paste Printing – Apply solder paste on PCB pads using a stencil.

  2. SPI (Solder Paste Inspection) – Automated inspection of paste deposits.

  3. Pick and Place – High-speed machines place SMDs on the PCB.

  4. Reflow Soldering – PCBs go through a reflow oven to melt the solder paste and bond components.

  5. AOI (Automated Optical Inspection) – Inspect for solder defects, misalignments, missing parts.

6. 🧷 THT (Through-Hole Technology) Assembly

• Objective: Assemble larger or mechanically strong components not suitable for SMT.

• Process Steps:

  1. Manual or machine insertion of THT components into PCB holes.

  2. Wave soldering or selective soldering to attach component leads.

  3. Visual inspection to check for solder bridges, proper insertion, polarity.

7. 🔍 In-Process Quality Control (IPQC)

• Objective: Monitor and maintain quality during assembly processes.

• Activities:

  • Inspect boards at critical process checkpoints.

  • Measure solder joints, alignment, polarity.

  • Record any deviations and initiate corrective actions.

• Tools: AOI machines, magnifiers, inspection microscopes.

8. 🧪 Functional Testing (FCT)

• Objective: Verify that the assembled PCB functions as intended.

• Activities:

  • Apply power to the board and simulate real-world operating conditions.

  • Check signals, voltages, logic outputs, communication ports.

  • Record pass/fail results and diagnostics.

• Methods:

  • Bed-of-nails test fixtures

  • Flying probe testers

  • Custom test jigs

9. 🌡️ Environmental and Reliability Testing (if applicable)

• Objective: Ensure the product can withstand environmental stress and long-term use.

• Tests May Include:

  • Temperature cycling

  • Humidity testing

  • Vibration testing

  • Salt spray (corrosion) testing

  • Burn-in testing for extended operation

10. 📦 Box Build / System Integration

• Objective: Final assembly of the product into its enclosure/housing.

• Activities:

  • Mount PCB into mechanical casings.

  • Connect displays, fans, buttons, batteries.

  • Assemble cables, connectors, fasteners.

  • Perform another round of functional tests (as needed).

• Output: A fully assembled and working product.

11. 🏷️ Packaging and Labeling

• Objective: Safely package the product for delivery and ensure correct labeling.

• Activities:

  • ESD-safe packaging, foam inserts, shock-proof boxing.

  • Apply serial numbers, QR codes, product labels, warranty stickers.

  • Add user manuals, accessories, compliance certificates.

• Compliance: CE, FCC, RoHS, UL labeling (if required).

12. 📦 Finished Goods (FG) Handling

• Objective: Store completed products awaiting shipment.

• Activities:

  • Move tested and boxed units to Finished Goods warehouse.

  • Update ERP system with FG inventory.

  • Perform final QC audits (optional).

  • Prepare delivery documentation (invoice, packing list).

13. 🚚 Delivery and Dispatch

• Objective: Ship products to customers, distributors, or end-users.

• Activities:

  • Coordinate with logistics partners (FedEx, DHL, etc.)

  • Generate tracking IDs, customs paperwork (if international).

  • Confirm delivery with the customer.

• Post-Delivery: After-sales support, warranty tracking, returns handling.