Course Content
Electronics Components Introduction
Detail study about Electronics Component Required for Electronics Product Manuafcturing
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🏭 Electronics Manufacturing Process – Step-by-Step Overview
🏭 Electronics Manufacturing Process – Step-by-Step Overview
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6.THT (Through-Hole Technology) Assembly Process
THT (Through-Hole Technology) Assembly
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9. Functional Testing (FCT)
Functional Testing (FCT)
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10.Repair and Rework Process
Repair and Rework Process
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11. 🌡️ Environmental and Reliability Testing (if applicable)
🌡️ Environmental and Reliability Testing (if applicable)
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12. 📦 Box Build / System Integration
📦 Box Build / System Integration
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13.🔗 Traceability in Electronics Manufacturing
🔗 Traceability in Electronics Manufacturing
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14.Industry 4.0 in Electronics manufacturing
Industry 4.0 in Electronics manufacturing
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15. 🏷️ Packaging and Labeling
🏷️ Packaging and Labeling
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16.✅ Key Principles of ESD Compliance
✅ Key Principles of ESD Compliance
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17. 📦 Finished Goods (FG) Handling and Delivery
📦 Finished Goods (FG) Handling and Delivery
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Professional in Electronics Manufacturing -SMT Process
About Lesson

FIFO / FEFO Implementation

Purpose: Ensure older stock is used first to avoid expiry or degradation.

  • FIFO (First In, First Out): Used for standard components.

  • FEFO (First Expired, First Out): Used for shelf-life items like adhesives, solder paste, MSDs.

Labels:

  • Include manufacture date, expiry date, and date of receipt on all packages.

Storage System Support:

  • Use color-coded stickers or digital bin scanning to enforce FIFO/FEFO rules.


 

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