Course Content
Electronics Components Introduction
Detail study about Electronics Component Required for Electronics Product Manuafcturing
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🏭 Electronics Manufacturing Process – Step-by-Step Overview
🏭 Electronics Manufacturing Process – Step-by-Step Overview
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6.THT (Through-Hole Technology) Assembly Process
THT (Through-Hole Technology) Assembly
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9. Functional Testing (FCT)
Functional Testing (FCT)
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10.Repair and Rework Process
Repair and Rework Process
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11. 🌡️ Environmental and Reliability Testing (if applicable)
🌡️ Environmental and Reliability Testing (if applicable)
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12. 📦 Box Build / System Integration
📦 Box Build / System Integration
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13.🔗 Traceability in Electronics Manufacturing
🔗 Traceability in Electronics Manufacturing
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14.Industry 4.0 in Electronics manufacturing
Industry 4.0 in Electronics manufacturing
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15. 🏷️ Packaging and Labeling
🏷️ Packaging and Labeling
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16.✅ Key Principles of ESD Compliance
✅ Key Principles of ESD Compliance
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17. 📦 Finished Goods (FG) Handling and Delivery
📦 Finished Goods (FG) Handling and Delivery
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Professional in Electronics Manufacturing -SMT Process
About Lesson

1. Detection of Non-Conformance

Objective:
Identify any non-conformance at various inspection points during the manufacturing process.

Actions:

  • Inspecting components during the assembly process (SMT, THT, manual soldering).

  • Using Automated Optical Inspection (AOI), X-ray inspection, and manual visual inspection to spot defects.

  • Common types of non-conformance can include:

    • Soldering defects (cold joints, bridging, tombstoning)

    • Component misplacement or incorrect orientation

    • Missing components

    • Incorrect solder paste application

    • Component damage or bent leads

    • Surface contamination or flux residue


2. Immediate Segregation of Non-Conforming Units

Objective:
Prevent defective units from proceeding further down the production line.

Actions:

  • Segregate defective units immediately from the production line.

  • Use visual tags or bins clearly marked for non-conforming units (Red bins for rejected items).

  • Label the non-conforming products with a Non-Conformance Report (NCR) or identification tags that include:

    • Date and time of detection

    • Defect type

    • Inspection point (e.g., post-soldering, post-placement)

    • Operator ID

    • Serial number or lot number

  • Keep these units in a designated quarantine area.


3. Root Cause Analysis (RCA)

Objective:
Identify the underlying cause of the non-conformance to prevent recurrence.

Actions:

  • Perform a root cause analysis to determine why the defect occurred. This is typically done using techniques like:

    • 5 Whys: Ask “why” iteratively to trace back to the source of the problem.

    • Fishbone Diagram (Ishikawa): Identify potential root causes by analyzing the process, materials, people, equipment, environment, and methods.

    • Failure Mode and Effect Analysis (FMEA): Prioritize the severity and likelihood of various defects and their potential effects on the product.

  • Review production data logs, machine parameters, and operator actions during the process to spot any abnormalities.

  • Engage cross-functional teams (quality control, production, design engineers) to contribute their insights.


4. Corrective Actions (CAPA)

Objective:
Develop and implement corrective actions to eliminate the root cause and prevent recurrence of non-conformances.

Actions:

  • Corrective Action: Implement immediate actions to fix the specific non-conformance detected (e.g., rework the defective unit).

    • Examples: Replace defective components, rework solder joints, adjust machine settings.

  • Preventive Action: Implement long-term measures to prevent similar defects in the future (e.g., process changes, training, equipment maintenance).

    • Examples: Improve training programs, update work instructions, calibrate machines, upgrade equipment.

  • Maintain documentation of all corrective and preventive actions taken, including results, timelines, and responsibilities.


5. Documentation and Non-Conformance Report (NCR)

Objective:
Ensure traceability and proper documentation for auditing, analysis, and future reference.

Actions:

  • Fill out a Non-Conformance Report (NCR) for each non-conformance detected, including:

    • Description of the defect

    • Root cause analysis

    • Corrective and preventive actions (CAPA)

    • Responsible personnel

    • Date of issue and closure

    • Status of rework or rejection

  • The NCR should be stored electronically in an ERP system or quality management system for easy retrieval during audits and reviews.


6. Rework Process

Objective:
Fix the non-conforming units that can be reworked and bring them back to compliance with the quality standards.

Actions:

  • Determine if the unit can be reworked or needs to be scrapped.

  • If rework is possible, ensure it is done under strict supervision and with detailed documentation.

  • Common rework activities can include:

    • Soldering rework: Fixing cold joints, removing solder bridges, etc.

    • Component replacement: Changing faulty or incorrect components.

    • Component realignment: Correcting misplacements and ensuring proper orientation.

  • After rework, conduct thorough testing and inspection to verify the unit meets all quality standards.


7. Approval and Clearance

Objective:
Once reworked or adjusted, ensure that non-conforming units are validated and cleared for further processing.

Actions:

  • After rework or correction, the unit should be inspected and tested again to ensure compliance with the quality standards.

  • The unit should go through another round of final inspection and functional testing.

  • A quality engineer or designated authority must review the NCR and rework outcomes and approve or reject the product for final shipment.


8. Monitoring and Trend Analysis

Objective:
Track and monitor the frequency and types of non-conformance to identify patterns and prevent systemic issues.

Actions:

  • Track non-conformance metrics, such as:

    • Defects per million opportunities (DPMO)

    • First pass yield (FPY)

    • Rework rate

    • Non-conformance frequency

  • Use statistical process control (SPC) tools to monitor production trends and identify deviations.

  • Regularly review NCR data to identify recurring issues and refine preventive actions.


9. Continuous Improvement

Objective:
Drive continuous improvement in the manufacturing process to reduce the occurrence of non-conformances.

Actions:

  • Conduct Kaizen events (continuous improvement) to engage employees and engineers in identifying opportunities to improve processes.

  • Analyze non-conformance trends, customer complaints, and production data to spot areas for improvement.

  • Regularly update standard operating procedures (SOPs), work instructions, and training programs based on lessons learned from non-conformance incidents.

  • Review and update quality control checklists and inspection protocols to ensure that defects are detected at earlier stages.


10. Final Disposition of Non-Conforming Units

Objective:
Ensure proper disposition of units that cannot be reworked and meet quality standards.

Actions:

  • For units that cannot be reworked or fixed, they should be scrapped or returned to the supplier if the issue is related to material defects.

  • The decision to scrap should be made based on the severity of the non-conformance and the potential impact on product functionality, safety, or customer satisfaction.

  • Non-conforming scrap should be disposed of in an environmentally responsible manner and documented for traceability.


Key Performance Indicators (KPIs) for Non-Conformance Management

KPI Description
Non-Conformance Rate (NCR) The number of non-conforming units divided by the total units produced.
Rework Rate The percentage of defective units that were reworked.
Corrective Action Closure Time Time taken to implement corrective actions from detection to resolution.
Root Cause Resolution Time The average time taken to identify and resolve the root cause of a non-conformance.
Defect Trends Analysis of recurring defects over time (e.g., types of defects, process steps).

 

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