Here’s a comprehensive course content outline for “Introduction to Surface Mount Technology (SMT)”. This course is ideal for electronics engineering students, technicians, and professionals entering PCB assembly or electronics manufacturing.

📘 Course Title: Introduction to Surface Mount Technology (SMT)

🎯 Course Objectives:

By the end of this course, students will:

• Understand the fundamentals of SMT and how it differs from through-hole technology.

• Identify common SMT components and their functions.

• Gain insights into PCB design and layout for SMT.

• Learn the SMT manufacturing process from solder paste application to inspection.

• Develop awareness of SMT equipment, standards, and quality control methods.

📚 Course Modules:

Module 1: Introduction to SMT

• Evolution of electronics assembly

• What is Surface Mount Technology?

• Comparison: SMT vs Through-Hole Technology

• Applications of SMT in modern electronics

Module 2: SMT Components and Packages

• Passive components: Resistors, capacitors, inductors (e.g., 0402, 0603 sizes)

• Active components: Diodes, transistors, ICs

• Common IC packages: SOIC, QFP, BGA, QFN, CSP

• Component marking and identification

Module 3: PCB Design for SMT

• PCB layer structure and materials

• Design rules for SMT layout

• Pad design and footprint libraries

• Design for Manufacturability (DFM) principles

Module 4: Soldering and Assembly Process

• Solder paste composition and application (screen printing)

• Component placement techniques (manual vs automated)

• Reflow soldering: process, profiles, and ovens

• Wave and selective soldering (when mixed technology is used)

• Hand soldering techniques (for rework and prototypes)

Module 5: SMT Equipment Overview

• Solder paste printer

• Pick and Place machine

• Reflow oven

• AOI (Automated Optical Inspection)

• X-ray inspection and SPI (Solder Paste Inspection)

• Rework and repair stations

Module 6: Inspection, Testing, and Quality Control

• Common SMT defects (e.g., tombstoning, solder bridges)

• Visual inspection criteria

• In-circuit testing (ICT) and functional testing (FCT)

• IPC standards (e.g., IPC-A-610)

Module 7: SMT Manufacturing Environment

• Cleanroom and ESD requirements

• Materials management and traceability

• Lean manufacturing principles in SMT

• Role of MES (Manufacturing Execution Systems)

Module 8: Trends and Innovations in SMT

• Miniaturization and advanced packaging

• 3D printing in SMT

• Embedded components and flexible circuits

• Challenges in high-density interconnects (HDI)

🛠️ Hands-On Activities / Labs (Optional)

• Identify and categorize SMT components

• Use design software to create a simple SMT PCB layout

• Solder SMT components using hot air and reflow methods

• Perform AOI on a sample board

• Analyze sample defects under a microscope

📖 Assessment & Evaluation:

• Quizzes at the end of each module

• Final project: Design and assemble a basic SMT circuit

• Lab performance evaluation (if applicable)

• Written exam based on real-world SMT scenarios

📦 Recommended Resources:

• IPC-A-610: Acceptability of Electronic Assemblies

• SMT magazines and blogs (e.g., SMT007, Circuits Assembly)

• PCB design tools: KiCad, Altium Designer

• Video demonstrations of SMT assembly

Course Link : https://www.udemy.com/course/introduction-to-electronics-manufacturing-process